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CVE-2018-11277

CVE.org · Published

Historical CVEsJSONAI instructions

Record status
Published
Identifier year (not publication year)
2018
Source publication
Source updated
Imported by cveboard
Source snapshot
cve_2026-10-24_midnight_baseline ·

Plain text

CNA source text (English)

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Scoped product and version facts

Fix information unknown; no fixed version is derived here. Missing information does not prove that no fix exists.

Exploitation unknown; this catalogue does not assess exploitation.

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

Vendor
Qualcomm, Inc.
Product
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Platforms
Unknown
Default status
Unknown
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear · Scoped product and version facts
Version (version)Status (status)Version scheme (versionType)Exclusive end (lessThan)Inclusive end (lessThanOrEqual)Status changes (at → status)
MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660affectedUnavailableUnavailableUnavailableNone listed